ESP32-C3-MINI-1

module
Espressif Systems Datasheet ↗

Integrating Espressif's ESP32-C3FH4/FN4 SiP (160 MHz 32-bit RISC-V core, 400 KB SRAM, and 4 MB in-package Quad SPI flash) with a 40 MHz crystal, the ESP32-C3-MINI-1 shrinks 2.4 GHz Wi-Fi 4 and Bluetooth 5.0 LE connectivity into 13.2×16.6 mm (PCB antenna) and 13.2×12.5 mm (MINI-1U external antenna) 0.8 mm LGA footprints shared across Espressif's MINI family. Fifteen exposed 3.3 V GPIOs (IO0–IO10, IO18–IO21) support GPIO Matrix routing for UART, SPI2, I2C0, I2S0, TWAI, LEDC PWM, and native USB Serial/JTAG (IO18/IO19). Five 12-bit SAR ADC1 inputs cover IO0–IO4 across a 3.0 V–3.6 V rail. All I/Os are strictly non-5V-tolerant, and IO8/IO9 boot strapping rules apply.

ESPRESSIF ESP32-C3-MINI-1 1 GND GND GND 2 GND GND GND 3 3V3 ! 3V3 3V3 4 NC 5 IO2 ! GPIO2 ADC1_CH2 SPI PWM +2 GPIO2 ADC1_CH2 FSPIQ LEDC_CH2 6 IO3 GPIO3 ADC1_CH3 LEDC_CH3 GPIO3 ADC1_CH3 LEDC_CH3 7 NC 8 EN ! CHIP_EN CHIP_EN 9 NC 10 NC 11 GND GND GND 12 IO0 GPIO0 ADC1_CH0 Clock PWM +2 GPIO0 ADC1_CH0 XTAL_32K_P LEDC_CH0 13 IO1 GPIO1 ADC1_CH1 Clock PWM +2 GPIO1 ADC1_CH1 XTAL_32K_N LEDC_CH1 14 GND GND GND 15 NC 16 IO10 GPIO10 FSPICS0 LEDC_CH4 GPIO10 FSPICS0 LEDC_CH4 17 NC 18 IO4 ! GPIO4 ADC1_CH4 SPI Debug PWM +3 GPIO4 ADC1_CH4 FSPIHD MTMS LEDC_CH4 19 IO5 ! GPIO5 ADC2_CH0 SPI Debug PWM +3 GPIO5 ADC2_CH0 FSPIWP MTDI LEDC_CH5 20 IO6 ! GPIO6 FSPICLK Debug PWM +2 GPIO6 FSPICLK MTCK LEDC_CH0 21 IO7 ! GPIO7 FSPID Debug PWM +2 GPIO7 FSPID MTDO LEDC_CH1 22 IO8 ! GPIO8 LEDC_CH2 GPIO8 LEDC_CH2 23 IO9 ! GPIO9 LEDC_CH3 GPIO9 LEDC_CH3 24 NC 25 NC 26 IO18 ! GPIO18 USB_D- UART PWM +2 GPIO18 USB_D- U0RTS LEDC_CH4 27 IO19 ! GPIO19 USB_D+ UART PWM +2 GPIO19 USB_D+ U0CTS LEDC_CH5 28 NC 29 NC 30 RXD0 ! GPIO20 U0RXD LEDC_CH0 GPIO20 U0RXD LEDC_CH0 31 TXD0 ! GPIO21 U0TXD LEDC_CH1 GPIO21 U0TXD LEDC_CH1 32 NC 33 NC 34 NC 35 NC 36-53 GND GND GND

Onboard Peripherals & Internal Signals

In-Package Quad SPI Flash (4 MB) QSPI
Chip Pad: GPIO14
Stacked inside ESP32-C3FH4/FN4 on VDD_SPI (GPIO11) and GPIO12–GPIO17

Quad SPI XIP flash is integrated inside the QFN-32 SiP package under the RF shield.

Pin Assignment Planner

Add the peripherals you need and plan the pin assignments

Full Pin Reference (36 Pins)

Pin # Label Type Functions Warnings & Notes
1 GND ground GND
Module system ground (0V)
2 GND ground GND
Module system ground (0V)
3 3V3 power 3V3
[CAUTION] 3.0V–3.6V supply only (>=500 mA regulator + 10 µF & 0.1 µF bypass caps near Pin 3)
Wi-Fi transmit bursts require low-impedance 3.3V power delivery. Exceeding 3.6V permanently damages the SoC.
Main 3.3V module power supply input (3.0V–3.6V; >=500 mA current capability recommended)
4 NC nc —
No internal connection — leave floating on host PCB
5 IO2 GPIO2 mixed GPIO2 ADC1_CH2 FSPIQ LEDC_CH2
[CAUTION] Boot strapping pin (must be HIGH during Download Boot)
Sampled at reset with no internal pull-up enabled. Keep GPIO2 HIGH (or add a 10 kΩ pull-up) when entering Joint Download Boot via GPIO9=LOW to prevent unintended glitch modes.
RTC/Digital GPIO2, 12-bit ADC1_CH2, direct IO_MUX SPI2 MISO (FSPIQ), and boot strapping pin
6 IO3 GPIO3 mixed GPIO3 ADC1_CH3 LEDC_CH3
RTC/Digital GPIO3 and 12-bit ADC1_CH3 (3.3V max, NOT 5V tolerant)
7 NC nc —
No internal connection — leave floating on host PCB
8 EN CHIP_PU reset CHIP_EN
[CAUTION] Active-HIGH chip enable/reset — never leave floating
High enables chip; Low powers off chip. Add an external RC delay circuit (10 kΩ pull-up to 3.3V and 1 µF capacitor to GND) to meet power-on reset timing.
High-enable / active-low chip reset input (CHIP_EN / EN)
9 NC nc —
No internal connection — leave floating on host PCB
10 NC nc —
No internal connection — leave floating on host PCB
11 GND ground GND
Module system ground (0V)
12 IO0 GPIO0 mixed GPIO0 ADC1_CH0 XTAL_32K_P LEDC_CH0
RTC/Digital GPIO0, 12-bit ADC1_CH0, and 32.768 kHz crystal P (3.3V max, NOT 5V tolerant)
13 IO1 GPIO1 mixed GPIO1 ADC1_CH1 XTAL_32K_N LEDC_CH1
RTC/Digital GPIO1, 12-bit ADC1_CH1, and 32.768 kHz crystal N (3.3V max, NOT 5V tolerant)
14 GND ground GND
Module system ground (0V)
15 NC nc —
No internal connection — leave floating on host PCB
16 IO10 GPIO10 digital GPIO10 FSPICS0 LEDC_CH4
Digital GPIO10 and direct IO_MUX SPI2 CS0 (FSPICS0) (3.3V max, NOT 5V tolerant)
17 NC nc —
No internal connection — leave floating on host PCB
18 IO4 GPIO4 mixed GPIO4 ADC1_CH4 FSPIHD MTMS LEDC_CH4
[INFO] Dedicated JTAG MTMS pin if external JTAG probe is enabled
Free for ADC1_CH4, SPI2, or general GPIO when debugging over native USB Serial/JTAG (GPIO18/GPIO19).
RTC/Digital GPIO4, 12-bit ADC1_CH4, FSPIHD, and JTAG MTMS (3.3V max, NOT 5V tolerant)
19 IO5 GPIO5 mixed GPIO5 ADC2_CH0 FSPIWP MTDI LEDC_CH5
[CAUTION] ADC2_CH0 affected by silicon errata [ADC-183] & Wi-Fi arbitration — prefer GPIO0–GPIO4 for analog
Hardware errata [ADC-183] disables continuous/DMA ADC2 operation on ESP32-C3, and ADC2 is shared with the Wi-Fi radio. Safe as a standard digital GPIO; use GPIO0–GPIO4 (ADC1) for reliable analog reads.
RTC/Digital GPIO5, ADC2_CH0 (see errata), FSPIWP, and JTAG MTDI
20 IO6 GPIO6 digital GPIO6 FSPICLK MTCK LEDC_CH0
[INFO] Dedicated JTAG MTCK pin if external JTAG probe is enabled
Completely free for high-speed IO_MUX SPI2 SCK, I2C, or GPIO when using native USB Serial/JTAG.
Digital GPIO6, direct IO_MUX SPI2 SCK (FSPICLK), and JTAG MTCK (3.3V max, NOT 5V tolerant)
21 IO7 GPIO7 digital GPIO7 FSPID MTDO LEDC_CH1
[INFO] Dedicated JTAG MTDO pin if external JTAG probe is enabled
Completely free for high-speed IO_MUX SPI2 MOSI, I2C, or GPIO when using native USB Serial/JTAG.
Digital GPIO7, direct IO_MUX SPI2 MOSI (FSPID), and JTAG MTDO (3.3V max, NOT 5V tolerant)
22 IO8 GPIO8 digital GPIO8 LEDC_CH2
[CAUTION] Boot mode & ROM log strapping pin (floating at reset — MUST be HIGH for Download Boot)
Sampled at reset with no internal pull-up. Entering Joint Download Boot (GPIO9=LOW) strictly requires GPIO8=HIGH (GPIO8=0 & GPIO9=0 is an invalid boot state!). Add an external 10 kΩ pull-up if external circuitry could pull GPIO8 low at reset.
Digital GPIO8 (Download Boot gate & ROM UART0 print strapping pin)
23 IO9 GPIO9 digital GPIO9 LEDC_CH3
[CAUTION] Boot mode strapping pin (weak internal pull-up: HIGH=SPI Boot, LOW=Download Boot)
Sampled at reset with internal ~45 kΩ pull-up enabled. Pulling GPIO9 LOW during reset while GPIO8=HIGH enters Joint Download Boot (USB Serial/JTAG + UART0). Avoid external loads that pull GPIO9 low at power-on.
Digital GPIO9 (BOOT button strapping pin with internal weak pull-up)
24 NC nc —
No internal connection — leave floating on host PCB
25 NC nc —
No internal connection — leave floating on host PCB
26 IO18 GPIO18 special GPIO18 USB_D- U0RTS LEDC_CH4
[CAUTION] Native Full-Speed USB Serial/JTAG D− differential line
Enabled by default as USB D− for flashing, CDC console, and JTAG debugging. Reconfiguring GPIO18 as digital I/O disconnects native USB until reset.
Native USB 2.0 Full-Speed Serial/JTAG D− pad / Digital GPIO18
27 IO19 GPIO19 special GPIO19 USB_D+ U0CTS LEDC_CH5
[CAUTION] Native Full-Speed USB Serial/JTAG D+ line (internal 1.5 kΩ USB pull-up active at reset)
Enabled by default with an internal USB D+ pull-up to 3.3V at reset. Reconfiguring GPIO19 as digital I/O disconnects native USB Serial/JTAG.
Native USB 2.0 Full-Speed Serial/JTAG D+ pad / Digital GPIO19
28 NC nc —
No internal connection — leave floating on host PCB
29 NC nc —
No internal connection — leave floating on host PCB
30 RXD0 GPIO20 digital GPIO20 U0RXD LEDC_CH0
[INFO] Default ROM bootloader UART0 RX input (internal pull-up active during boot)
Used by the ROM serial bootloader alongside USB Serial/JTAG in Download Boot mode. Freely usable for UART0 RX or general GPIO after boot.
Digital GPIO20 and default UART0 RX (U0RXD) (3.3V max, NOT 5V tolerant)
31 TXD0 GPIO21 digital GPIO21 U0TXD LEDC_CH1
[INFO] Default ROM bootloader UART0 TX output (emits 115200 baud boot log at reset)
Outputs ROM boot diagnostic messages on reset unless suppressed by GPIO8 / EFUSE_UART_PRINT_CONTROL. Freely usable for UART0 TX or general GPIO after boot.
Digital GPIO21 and default UART0 TX (U0TXD) (3.3V max, NOT 5V tolerant)
32 NC nc —
No internal connection — leave floating on host PCB
33 NC nc —
No internal connection — leave floating on host PCB
34 NC nc —
No internal connection — leave floating on host PCB
35 NC nc —
No internal connection — leave floating on host PCB
36-53 GND ground GND
Underside LGA shield-return & central 3×3 exposed thermal ground pad array (Pins 36–53, 0V)