ESP8684-MINI-1

module
Espressif Systems Datasheet ↗

Integrating Espressif's 120 MHz 32-bit RISC-V ESP8684H2/H4 (ESP32-C2) SiP, 2 MB or 4 MB of stacked Quad SPI flash, and a 26 MHz crystal, the ESP8684-MINI-1 packs 2.4 GHz Wi-Fi 4 and Bluetooth 5 LE into 13.2×16.6 mm (PCB antenna) and 13.2×12.5 mm (MINI-1U external antenna) 53-pad 0.8 mm LGA footprints compatible with Espressif's MINI-1 series. Fourteen exposed 3.3 V GPIOs (IO0–IO10, IO18, RXD0/IO19, TXD0/IO20) support GPIO Matrix routing for 2× UART, SPI2, I2C0, and 6× LEDC PWM channels (no native USB). Five 12-bit SAR ADC1 inputs cover IO0–IO4 across a 3.0 V–3.6 V supply. All pads are strictly non-5V-tolerant, and IO8/IO9 strapping rules apply.

ESPRESSIF 8684-MINI-1U 1 GND GND GND 2 GND GND GND 3 3V3 ! 3V3 3V3 4 NC 5 IO2 GPIO2 ADC1_CH2 SPI PWM +2 GPIO2 ADC1_CH2 FSPIQ LEDC_CH2 6 IO3 ! GPIO3 ADC1_CH3 LEDC_CH3 GPIO3 ADC1_CH3 LEDC_CH3 7 NC 8 EN ! CHIP_EN CHIP_EN 9 NC 10 NC 11 GND GND GND 12 IO0 ! GPIO0 ADC1_CH0 Clock PWM +2 GPIO0 ADC1_CH0 XTAL_32K_P LEDC_CH0 13 IO1 ! GPIO1 ADC1_CH1 Clock PWM +2 GPIO1 ADC1_CH1 XTAL_32K_N LEDC_CH1 14 GND GND GND 15 NC 16 IO10 GPIO10 FSPICS0 LEDC_CH4 GPIO10 FSPICS0 LEDC_CH4 17 NC 18 IO4 ! GPIO4 ADC1_CH4 SPI Debug PWM +3 GPIO4 ADC1_CH4 FSPIHD MTMS LEDC_CH4 19 IO5 ! GPIO5 SPI Debug PWM +3 GPIO5 FSPIWP MTDI LEDC_CH5 20 IO6 ! GPIO6 FSPICLK Debug PWM +2 GPIO6 FSPICLK MTCK LEDC_CH0 21 IO7 ! GPIO7 FSPID Debug PWM +2 GPIO7 FSPID MTDO LEDC_CH1 22 IO8 ! GPIO8 LEDC_CH2 GPIO8 LEDC_CH2 23 IO9 ! GPIO9 LEDC_CH3 GPIO9 LEDC_CH3 24 NC 25 NC 26 IO18 GPIO18 LEDC_CH5 GPIO18 LEDC_CH5 27 NC 28 NC 29 NC 30 RXD0 ! GPIO19 U0RXD LEDC_CH0 GPIO19 U0RXD LEDC_CH0 31 TXD0 ! GPIO20 U0TXD LEDC_CH1 GPIO20 U0TXD LEDC_CH1 32 NC 33 NC 34 NC 35 NC 36-53 GND GND GND

Onboard Peripherals & Internal Signals

In-Package Quad SPI Flash (2 MB / 4 MB) QSPI
Chip Pad: GPIO11
Stacked inside ESP8684H2/H4 on internal pads GPIO11–GPIO17

Quad SPI XIP flash is integrated inside the QFN-24 SiP package under the RF shield.

26 MHz RF Reference Crystal Clock
Chip Pad: XTAL_P
Precision 26 MHz ±10 ppm crystal inside RF shield (select CONFIG_XTAL_FREQ_26 in ESP-IDF)

Ensure firmware configures 26 MHz XTAL frequency.

External Coaxial Antenna Receptacle (W.FL / MHF III) System
Chip Pad: ANT
Compact 2.0×2.0 mm 50Ω coaxial connector (compatible with Hirose W.FL / I-PEX MHF III)

MINI-1U uses the compact W.FL / MHF III coaxial footprint rather than full-size U.FL / MHF I.

Pin Assignment Planner

Add the peripherals you need and plan the pin assignments

Full Pin Reference (36 Pins)

Pin # Label Type Functions Warnings & Notes
1 GND ground GND
Module system ground (0V)
2 GND ground GND
Module system ground (0V)
3 3V3 power 3V3
[CAUTION] 3.0V–3.6V supply only (>=500 mA regulator + 10 µF & 0.1 µF bypass caps near Pin 3)
Wi-Fi transmit bursts require low-impedance 3.3V power delivery. Exceeding 3.6V permanently damages the SoC.
Main 3.3V module power supply input (3.0V–3.6V; >=500 mA current capability recommended)
4 NC nc —
No internal connection — leave floating on host PCB
5 IO2 GPIO2 mixed GPIO2 ADC1_CH2 FSPIQ LEDC_CH2
RTC/Digital GPIO2, 12-bit ADC1_CH2, and direct IO_MUX SPI2 MISO (FSPIQ) (3.3V max, NOT 5V tolerant)
6 IO3 GPIO3 mixed GPIO3 ADC1_CH3 LEDC_CH3
[INFO] Brief low-level glitch possible during power-up reset
May experience a brief low-level pulse during initial power-on before I/O mux latches stabilize.
RTC/Digital GPIO3 and 12-bit ADC1_CH3 (3.3V max, NOT 5V tolerant)
7 NC nc —
No internal connection — leave floating on host PCB
8 EN CHIP_PU reset CHIP_EN
[CAUTION] Active-HIGH chip enable/reset — never leave floating
High enables chip; Low powers off chip. Add an external RC delay circuit (10 kΩ pull-up to 3.3V and 1 µF capacitor to GND) for clean power-on reset timing.
High-enable / active-low chip reset input (CHIP_EN / EN)
9 NC nc —
No internal connection — leave floating on host PCB
10 NC nc —
No internal connection — leave floating on host PCB
11 GND ground GND
Module system ground (0V)
12 IO0 GPIO0 mixed GPIO0 ADC1_CH0 XTAL_32K_P LEDC_CH0
[INFO] Brief low-level glitch possible during power-up reset
May experience a brief low-level pulse during initial power-on before I/O mux latches stabilize.
RTC/Digital GPIO0, 12-bit ADC1_CH0, and optional 32.768 kHz crystal P (3.3V max, NOT 5V tolerant)
13 IO1 GPIO1 mixed GPIO1 ADC1_CH1 XTAL_32K_N LEDC_CH1
[INFO] Brief low-level glitch possible during power-up reset
May experience a brief low-level pulse during initial power-on before I/O mux latches stabilize.
RTC/Digital GPIO1, 12-bit ADC1_CH1, and optional 32.768 kHz crystal N (3.3V max, NOT 5V tolerant)
14 GND ground GND
Module system ground (0V)
15 NC nc —
No internal connection — leave floating on host PCB
16 IO10 GPIO10 digital GPIO10 FSPICS0 LEDC_CH4
Digital GPIO10 and direct IO_MUX SPI2 CS0 (FSPICS0) (3.3V max, NOT 5V tolerant)
17 NC nc —
No internal connection — leave floating on host PCB
18 IO4 GPIO4 mixed GPIO4 ADC1_CH4 FSPIHD MTMS LEDC_CH4
[INFO] Dedicated JTAG MTMS pin (no native USB JTAG on ESP32-C2)
Used as JTAG TMS when debugging via external JTAG probe; freely usable for ADC1_CH4 or GPIO otherwise.
RTC/Digital GPIO4, 12-bit ADC1_CH4, FSPIHD, and JTAG MTMS (3.3V max, NOT 5V tolerant)
19 IO5 GPIO5 digital GPIO5 FSPIWP MTDI LEDC_CH5
[INFO] Dedicated JTAG MTDI pin & brief power-up low glitch
Digital-only on ESP32-C2 (ADC1 spans GPIO0–GPIO4 only). Used for JTAG TDI if hardware JTAG is active.
RTC/Digital GPIO5 (digital only — no ADC on ESP32-C2), FSPIWP, and JTAG MTDI
20 IO6 GPIO6 digital GPIO6 FSPICLK MTCK LEDC_CH0
[INFO] Dedicated JTAG MTCK pin when hardware JTAG debugging is used
Freely usable for direct IO_MUX SPI2 SCK (FSPICLK), I2C, or GPIO when JTAG is unused.
Digital GPIO6, direct IO_MUX SPI2 SCK (FSPICLK), and JTAG MTCK (3.3V max, NOT 5V tolerant)
21 IO7 GPIO7 digital GPIO7 FSPID MTDO LEDC_CH1
[INFO] Dedicated JTAG MTDO pin when hardware JTAG debugging is used
Freely usable for direct IO_MUX SPI2 MOSI (FSPID), I2C, or GPIO when JTAG is unused.
Digital GPIO7, direct IO_MUX SPI2 MOSI (FSPID), and JTAG MTDO (3.3V max, NOT 5V tolerant)
22 IO8 GPIO8 digital GPIO8 LEDC_CH2
[CAUTION] Boot mode & ROM log strapping pin (floating at reset — MUST be HIGH for Download Boot)
Sampled at reset with no internal pull-up. Entering UART0 Download Boot (GPIO9=LOW) strictly requires GPIO8=HIGH (GPIO8=0 & GPIO9=0 is an invalid boot state!). Add a 10 kΩ pull-up if external circuitry could pull GPIO8 low at reset.
Digital GPIO8 (Download Boot gate & ROM UART0 print strapping pin)
23 IO9 GPIO9 digital GPIO9 LEDC_CH3
[CAUTION] Boot mode strapping pin (weak internal pull-up: HIGH=SPI Boot, LOW=UART0 Download Boot)
Sampled at reset with internal weak pull-up enabled. Pulling GPIO9 LOW during reset while GPIO8=HIGH enters UART0 Download Boot (ESP32-C2 has no native USB). Avoid external loads holding GPIO9 low at power-up.
Digital GPIO9 (BOOT button strapping pin with internal weak pull-up)
24 NC nc —
No internal connection — leave floating on host PCB
25 NC nc —
No internal connection — leave floating on host PCB
26 IO18 GPIO18 digital GPIO18 LEDC_CH5
Digital GPIO18 (general-purpose I/O — note ESP32-C2 has no native USB peripheral)
27 NC nc —
No internal connection — leave floating on host PCB
28 NC nc —
No internal connection — leave floating on host PCB
29 NC nc —
No internal connection — leave floating on host PCB
30 RXD0 GPIO19 digital GPIO19 U0RXD LEDC_CH0
[INFO] Primary UART0 RX input for ROM firmware flashing & console
Because ESP32-C2 omits native USB, UART0 (GPIO19 RX / GPIO20 TX) is the sole serial firmware download interface.
Digital GPIO19 and default UART0 RX (U0RXD) (3.3V max, NOT 5V tolerant)
31 TXD0 GPIO20 digital GPIO20 U0TXD LEDC_CH1
[INFO] Primary UART0 TX output for ROM firmware flashing & boot log
Emits ROM boot log messages at reset unless suppressed via GPIO8. Serves as the sole serial flashing TX line.
Digital GPIO20 and default UART0 TX (U0TXD) (3.3V max, NOT 5V tolerant)
32 NC nc —
No internal connection — leave floating on host PCB
33 NC nc —
No internal connection — leave floating on host PCB
34 NC nc —
No internal connection — leave floating on host PCB
35 NC nc —
No internal connection — leave floating on host PCB
36-53 GND ground GND
Underside LGA shield-return & central 3×3 exposed thermal ground pad array (Pins 36–53, 0V)