ESP32-H2-WROOM-02C

module
Espressif Systems Datasheet ↗

Built around Espressif's 96 MHz 32-bit RISC-V ESP32-H2FH2/FH4 SoC (2 MB or 4 MB stacked Quad SPI flash) and a 32 MHz crystal, the ESP32-H2-WROOM-02C packages ultra-low-power Bluetooth 5.3 LE and IEEE 802.15.4 (Thread, Zigbee, Matter — no Wi-Fi) connectivity into an 18.0×20.0 mm 3-sided 1.27 mm-pitch castellated footprint. All 19 bonded ESP32-H2 GPIOs (IO0–IO5, IO8–IO14, IO22–IO27) plus the dedicated VBAT domain pin are exposed, supporting 2× UART, SPI2, 2× I2C, I2S0, TWAI (CAN), LEDC, MCPWM, and native USB Serial/JTAG on IO26/IO27. Five 12-bit SAR ADC1 inputs cover IO1–IO5 alongside zero-cross detection on IO10/IO11. All pads are strictly 3.3 V non-5V-tolerant, and IO8/IO9/IO25 strapping rules apply.

ESPRESSIF ESP32-H2-WROOM-02C 1 3V3 ! 3V3 3V3 2 EN ! CHIP_EN CHIP_EN 3 IO4 ! GPIO4 ADC1_CH3 SPI Debug PWM +3 GPIO4 ADC1_CH3 FSPICLK MTCK LEDC_CH4 4 IO5 ! GPIO5 ADC1_CH4 SPI Debug PWM +3 GPIO5 ADC1_CH4 FSPID MTDI LEDC_CH5 5 IO10 GPIO10 System PWM +3 GPIO10 ZCD0 LP_GPIO10 MCPWM0_1A 6 IO11 GPIO11 System PWM +3 GPIO11 ZCD1 LP_GPIO11 MCPWM0_1B 7 IO8 ! GPIO8 LP_GPIO8 MCPWM0_0A GPIO8 LP_GPIO8 MCPWM0_0A 8 IO9 ! GPIO9 LP_GPIO9 MCPWM0_0B GPIO9 LP_GPIO9 MCPWM0_0B 9 GND GND GND 10 IO12 GPIO12 LP_GPIO12 MCPWM0_2A GPIO12 LP_GPIO12 MCPWM0_2A 11 IO13 GPIO13 Clock System PWM +3 GPIO13 XTAL_32K_P LP_GPIO13 MCPWM0_2B 12 IO14 GPIO14 Clock System PWM +3 GPIO14 XTAL_32K_N LP_GPIO14 LEDC_CH0 13 GND GND GND 14 VBAT VBAT VBAT 15 IO22 GPIO22 LEDC_CH1 GPIO22 LEDC_CH1 16 NC 17 NC 18 NC 19 NC 20 IO25 ! GPIO25 FSPICS3 LEDC_CH4 GPIO25 FSPICS3 LEDC_CH4 21 RXD0 ! GPIO23 U0RXD SPI PWM +2 GPIO23 U0RXD FSPICS1 LEDC_CH2 22 TXD0 ! GPIO24 U0TXD SPI PWM +2 GPIO24 U0TXD FSPICS2 LEDC_CH3 23 IO26 ! GPIO26 USB_D- SPI PWM +2 GPIO26 USB_D- FSPICS4 LEDC_CH5 24 IO27 ! GPIO27 USB_D+ SPI PWM +2 GPIO27 USB_D+ FSPICS5 LEDC_CH0 25 IO3 ! GPIO3 ADC1_CH2 SPI Debug PWM +3 GPIO3 ADC1_CH2 FSPIHD MTDO LEDC_CH3 26 IO2 ! GPIO2 ADC1_CH1 SPI Debug PWM +3 GPIO2 ADC1_CH1 FSPIWP MTMS LEDC_CH2 27 IO1 GPIO1 ADC1_CH0 SPI PWM +2 GPIO1 ADC1_CH0 FSPICS0 LEDC_CH1 28 IO0 GPIO0 FSPIQ LEDC_CH0 GPIO0 FSPIQ LEDC_CH0 29 EPAD GND GND

Onboard Peripherals & Internal Signals

In-Package Quad SPI Flash (2 MB / 4 MB) QSPI
Chip Pad: GPIO15
Stacked inside ESP32-H2FH2/FH4 on internal pads GPIO15–GPIO21

Quad SPI XIP flash is integrated inside the QFN-32 SiP package under the RF shield.

32 MHz RF Crystal Oscillator Clock
Chip Pad: XTAL_P
Precision 32 MHz ±10 ppm reference crystal inside RF shield

Drives the BLE 5.3 and IEEE 802.15.4 2.4 GHz radio (no Wi-Fi transceiver on ESP32-H2).

Pin Assignment Planner

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Full Pin Reference (29 Pins)

Pin # Label Type Functions Warnings & Notes
1 3V3 power 3V3
[CAUTION] 3.0V–3.6V supply only (decouple with 10 µF + 0.1 µF near Pin 1)
Exceeding 3.6V permanently damages the ESP32-H2 silicon.
Main 3.3V module power supply input (3.0V–3.6V; >=350 mA output capability recommended)
2 EN CHIP_PU reset CHIP_EN
[CAUTION] Active-HIGH chip enable/reset — never leave floating
High enables chip; Low powers off chip. Add an external RC delay circuit (10 kΩ pull-up to 3.3V and 1 µF capacitor to GND).
High-enable / active-low chip reset input (CHIP_EN / EN)
3 IO4 GPIO4 mixed GPIO4 ADC1_CH3 FSPICLK MTCK LEDC_CH4
[INFO] Dedicated JTAG MTCK pin if external JTAG source is selected via GPIO25
Free for ADC1_CH3, direct IO_MUX SPI2 SCK, or GPIO when debugging via native USB Serial/JTAG.
Digital/Analog GPIO4, 12-bit ADC1_CH3, direct IO_MUX SPI2 SCK (FSPICLK), and JTAG MTCK
4 IO5 GPIO5 mixed GPIO5 ADC1_CH4 FSPID MTDI LEDC_CH5
[INFO] Dedicated JTAG MTDI pin if external JTAG source is selected via GPIO25
Free for ADC1_CH4, direct IO_MUX SPI2 MOSI, or GPIO when debugging via native USB Serial/JTAG.
Digital/Analog GPIO5, 12-bit ADC1_CH4, direct IO_MUX SPI2 MOSI (FSPID), and JTAG MTDI
5 IO10 GPIO10 mixed GPIO10 ZCD0 LP_GPIO10 MCPWM0_1A
Deep-sleep wakeable LP GPIO10 and Analog Comparator Ref / Zero-Cross Detector 0 (ZCD0)
6 IO11 GPIO11 mixed GPIO11 ZCD1 LP_GPIO11 MCPWM0_1B
Deep-sleep wakeable LP GPIO11 and Analog Comparator Input / Zero-Cross Detector 1 (ZCD1)
7 IO8 GPIO8 digital GPIO8 LP_GPIO8 MCPWM0_0A
[CAUTION] Boot mode & ROM log strapping pin (floating at reset — MUST be HIGH for Download Boot)
Sampled at reset with no internal pull-up. Entering Joint Download Boot (GPIO9=LOW) requires GPIO8=HIGH (GPIO8=0 & GPIO9=0 is invalid). Add a 10 kΩ pull-up if external circuitry could pull GPIO8 low at reset.
Deep-sleep wakeable LP GPIO8 (Download Boot gate & ROM UART0 print strapping pin)
8 IO9 GPIO9 digital GPIO9 LP_GPIO9 MCPWM0_0B
[CAUTION] Boot mode strapping pin (weak internal pull-up: HIGH=SPI Boot, LOW=Download Boot)
Sampled at reset with internal weak pull-up enabled. Pulling GPIO9 LOW during reset while GPIO8=HIGH enters Joint Download Boot (USB Serial/JTAG + UART0).
Deep-sleep wakeable LP GPIO9 (BOOT button strapping pin with internal weak pull-up)
9 GND ground GND
Module system ground (0V)
10 IO12 GPIO12 digital GPIO12 LP_GPIO12 MCPWM0_2A
Deep-sleep wakeable LP GPIO12 (3.3V max, NOT 5V tolerant)
11 IO13 GPIO13 digital GPIO13 XTAL_32K_P LP_GPIO13 MCPWM0_2B
Deep-sleep wakeable LP GPIO13 (VBAT domain) and optional 32.768 kHz RTC crystal P
12 IO14 GPIO14 digital GPIO14 XTAL_32K_N LP_GPIO14 LEDC_CH0
Deep-sleep wakeable LP GPIO14 (VBAT domain) and optional 32.768 kHz RTC crystal N
13 GND ground GND
Module system ground (0V)
14 VBAT power VBAT
Battery / LP & RTC domain power supply (3.0V–3.6V; tie to 3V3 if coin-cell backup is unused)
15 IO22 GPIO22 digital GPIO22 LEDC_CH1
Digital GPIO22 (3.3V max, NOT 5V tolerant)
16 NC nc —
No internal connection — leave floating on host PCB
17 NC nc —
No internal connection — leave floating on host PCB
18 NC nc —
No internal connection — leave floating on host PCB
19 NC nc —
No internal connection — leave floating on host PCB
20 IO25 GPIO25 digital GPIO25 FSPICS3 LEDC_CH4
[CAUTION] JTAG signal-source strapping pin (floating at reset — HIGH=USB JTAG, LOW=Pad JTAG)
Sampled at reset with NO internal pull resistor when EFUSE_DIS_PAD_JTAG=0 & EFUSE_USB_JTAG_SEL=1. Avoid external circuits pulling GPIO25 low at reset if native USB JTAG debugging is desired.
Digital GPIO25, FSPICS3, and JTAG source-selection strapping pin
21 RXD0 GPIO23 digital GPIO23 U0RXD FSPICS1 LEDC_CH2
[INFO] Default ROM bootloader UART0 RX input
Used by the ROM serial bootloader alongside USB Serial/JTAG in Download Boot mode. Freely usable after boot.
Digital GPIO23, default UART0 RX (U0RXD), and FSPICS1
22 TXD0 GPIO24 digital GPIO24 U0TXD FSPICS2 LEDC_CH3
[INFO] Default ROM bootloader UART0 TX output (emits boot log at reset)
Outputs ROM diagnostic messages at reset unless suppressed by GPIO8. Freely usable after boot.
Digital GPIO24, default UART0 TX (U0TXD), and FSPICS2
23 IO26 GPIO26 special GPIO26 USB_D- FSPICS4 LEDC_CH5
[CAUTION] Native Full-Speed USB Serial/JTAG D− differential line (40 mA max drive)
Enabled by default as USB D− for flashing, CDC console, and JTAG debugging. Reconfiguring GPIO26 as digital I/O disconnects native USB until reset.
Native USB 2.0 Full-Speed Serial/JTAG D− pad / Digital GPIO26
24 IO27 GPIO27 special GPIO27 USB_D+ FSPICS5 LEDC_CH0
[CAUTION] Native Full-Speed USB Serial/JTAG D+ line (internal 1.5 kΩ USB pull-up active at reset)
Enabled by default with an internal USB D+ pull-up to 3.3V at reset. Reconfiguring GPIO27 as digital I/O disconnects native USB Serial/JTAG.
Native USB 2.0 Full-Speed Serial/JTAG D+ pad / Digital GPIO27
25 IO3 GPIO3 mixed GPIO3 ADC1_CH2 FSPIHD MTDO LEDC_CH3
[INFO] Dedicated JTAG MTDO pin if external JTAG source is selected via GPIO25
Free for ADC1_CH2, SPI2, or GPIO when debugging via native USB Serial/JTAG.
Digital/Analog GPIO3, 12-bit ADC1_CH2, FSPIHD, and JTAG MTDO
26 IO2 GPIO2 mixed GPIO2 ADC1_CH1 FSPIWP MTMS LEDC_CH2
[INFO] Dedicated JTAG MTMS pin if external JTAG source is selected via GPIO25
Free for ADC1_CH1, SPI2, or GPIO when debugging via native USB Serial/JTAG (GPIO26/GPIO27).
Digital/Analog GPIO2, 12-bit ADC1_CH1, FSPIWP, and JTAG MTMS
27 IO1 GPIO1 mixed GPIO1 ADC1_CH0 FSPICS0 LEDC_CH1
Digital/Analog GPIO1, 12-bit ADC1_CH0, and direct IO_MUX SPI2 CS0 (FSPICS0) (3.3V max, NOT 5V tolerant)
28 IO0 GPIO0 digital GPIO0 FSPIQ LEDC_CH0
Digital GPIO0 (no ADC on ESP32-H2 — ADC1 starts at GPIO1) and direct IO_MUX SPI2 MISO (FSPIQ)
29 EPAD ground GND
Underside 3×3 exposed thermal & RF ground pad (connect to host ground plane via thermal vias)